Substrate for electrical device

ABSTRACT

Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a substrate for electricaldevice, and more particularly to a substrate which is enhancing thereliability of electrical device and downsizing an electrical device.

2. Description of the Related Art

Currently, both science and technology are developing rapidly,meanwhile, electrical devices are designed for thinner, widerapplication, lower cost, and better quality, wherein the better qualityof electrical device includes higher reliability and enhanced heatdissipation, in order to achieve above objects, the manufacturers keepon developing it.

FIG. 9 shows a conventional electrical device 9 comprising a substrate 1which including an insulator 30, a plurality of conductive elements 7,8and a via 5, wherein said insulator 30 having a first upper surface 31and a first lower surface 32, said first upper surface 31 of insulator30 having an receiving area 4 which is used for accommodating a chip;said conductive element 7 is formed on said first upper surface 31 ofinsulator 30 and surrounding said receiving area 4, said conductiveelement 8 formed on said first lower surface 32 of insulator 30, saidvia 5 electrically connected the conductive element 7 to the conductiveelement 8, wherein said via 5 having a through hole 6 (i.e. the via 5 ishollow) in which an filler 43 such as solder paste, epoxy, glue orsolder mask filled therein; a chip 20 mounted on the receiving area 4 ofsubstrate 1; a conductive wire 60 electrically connected the chip 20 tothe conductive element 7; an encapsulant 40 encapsulates the substrate1, chip 20 and conductive wire 60, a solder ball 50 attached to theconductive element 8 for electrically connecting to the outside (e.g. amother board); Accordingly, due to the solder ball 50, it is convenientfor said electrical device 9 to be electrically connected to theoutside, nevertheless, the cost of said electrical device 9 isincreased, Moreover, the solder ball 50 is attached to the conductiveelement 8 by the surface 53 of the solder ball 50 exclusively, it iseasy to cause peeling-off problems of said solder ball 50 by means ofcontamination which is happened while operating the attaching (solderball) process, thermal effects and/or other reasons such as collision.When the peeling-off problem happened, the solder ball 50 separated fromthe conductive element 8 easily, it may cause the electrical device 9not to be functional well. Furthermore, due to the via 5 is hollow, inthis manner, it is easy to cause a crack problem “E” of said via 5 bymeans of thermal effects, when the crack “E” happened, the conductiveelement 7 will not be electrically connected to the conductive element 8through said via 5 securely, then it will cause the electrical device 9not to be functional well either; In addition, the conductive wire 60electrically connected said chip 20 to said conductive element 7 ofsubstrate 1 by means of a wire-bonding process, wherein said substrate 1needs to be warm-up (i.e. heating; the temperature of heating is140˜300° C.) in order to ensure the conductive wire 60 electricallyconnected said chip 20 to said conductive element 7 firmly, whileoperating a wire-bonding process, wherein although there is a filler(e.g. solder paste) 43 filled into the through hole 6 of the via 5 forreinforcing the strength of the via 5, however said filler (solderpaste) 43 will become soft during the period of heating (due to themelting temperature of solder paste is about 183° C. usually), in thismanner, said conductive wire 60 does not enable to be electricallyconnected to said via 5 directly, but needs to be electrically connectedto the conductive element 7 instead, then it is necessary for thesubstrate 1 to be comprised of said conductive element 7, and then costis increased, besides, the designation of said substrate 1 is restrictedtoo.

SUMMARY OF THE INVENTION

It is therefore an object of the invention to solve the mentioned-aboveproblems, in accordance with the invention, the substrate includes aninsulator and a plurality of conductive elements, wherein the conductiveelements are embedded in the insulator, and a portion of conductiveelement exposed to the insulator for external connection, wherein someof the portion of conductive element exposed to the insulator enable toprotrude the insulator surface for external connection, In this manner,the solder balls are not needed. Moreover, the substrate of the presentinvention may further comprise a submember serving as a heat spreaderwhich is for enhancing the heat dissipation of chip, In addition, due tothe conductive element of substrate is solid and hard enough, inaccordance with the present invention, in this manner, the conductivewire enables to be electrically connected to the conductive elementdirectly, then cost is saved and the restriction for designing thesubstrate is decreased too, moreover, the conductive element ofsubstrate can further including an extending portion.

The aforementioned and further objects of the present invention will bemore adequately appeared from the detailed description, accompanyingdrawings and appended claims as follow.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a cross-sectional view of substrate in accordance with thepresent invention.

FIG. 1B shows a cross-sectional view of substrate in accordance with thepresent invention.

FIG. 1C shows a cross-sectional view of substrate in accordance with thepresent invention.

FIG. 1D shows a cross-sectional view of substrate in accordance with thepresent invention.

FIG. 1E shows a cross-sectional view of substrate in accordance with thepresent invention.

FIGS. 2-8 are cross-sectional views showing embodiments of electricaldevice in accordance with the present invention.

FIG. 9 shows a cross-sectional view of electrical device according to aprior art.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Embodiments of the present invention will be explained with reference tothe drawings as follow.

FIG. 1A shows a substrate 10 comprising: an insulator 30, said insulator30 having a first upper surface 31, a first lower surface 32 and a sidewall 37; a plurality of first conductive elements 70 which are made ofeither copper, copper alloy, nickel, aluminum, titanium or metallicalloy, said first conductive elements 70 are substantially solid; saidfirst conductive elements 70 having a first upper surface 71, a firstlower surface 72 and a first side edge 73 respectively, each said firstside edge 73 of the first conductive element 70 is encapsulated by theinsulator 30, in this manner, each first conductive element 70 embeddedin the insulator 30, wherein the first upper surface 71 of firstconductive element 70 exposed to the first upper surface 31 of insulator30 for external connection, and the first lower surface 72 of said firstconductive element 70 exposed to the first lower surface 32 of insulator30 for external connection too, wherein the first lower surface 72 offirst conductive element 70 is protruding the first lower surface 32 ofinsulator 30; then there is a height “H” between the first lower surface72 of first conductive element 70 and the first lower surface 32 ofinsulator 30, in this manner, the first lower surface 72 of firstconductive element 70 and the first lower surface 32 of insulator 30 arenot in the same horizontal level; a submember 80 serving as a heatspreader which having a first upper surface 81, a first lower surface82, a first side edge 83, an extending portion 85 and a cavity 86,wherein the cavity 86 of submember 80 is employed as the receiving areaof said substrate 10 for placing chip, conductive wires, encapsulant andadhesive means such as epoxy, glue etc., wherein said extending portion85 is for enhancing heat dissipation of chip (not shown), Furthermore,due to the first side edge 83 of submember 80 encapsulated by theinsulator 30, then the submember 80 embedded in the insulator 30, andthe first upper, lower surfaces 81,82 of submember 80 exposed to thefirst upper, lower surfaces 31, 32 of insulator 30 respectively, whereinthe first lower surface 82 of submember 80 also protruding the firstlower surface 32 of insulator 30, and the submember 80 may be made ofthe same material of the first conductive element 70 as required; inaddition, the submember 80 is optional; accordingly, (i.) due to thereis not any through hole in the first conductive element 70, then theproblem of crack will be avoided, and the reliability of substrate 10enhanced, and (ii.) due to the first lower surface 72 of firstconductive element 70 being protruded and exposed to the first lowersurface 32 of insulator 30, it is convenient for the first conductiveelement 70 to electrically connect to outside, then the solder ball isnot needed, the cost for manufacturing the substrate 10 decreased; and(iii.) due to the first conductive element 70 is made of metallicmaterial such as copper and is substantially solid, consequently, eventhough the substrate 10 is heating up to 140˜300° C., the firstconductive elements 70 will not become soft (because the meltingtemperature of the copper is about 1,083° C.), in this manner, it ishard enough for said first conductive elements 70 to be electricallyconnected to a conductive wire directly (refer to FIG. 2), then it isnot necessary for the substrate 10 to be comprised of a conductiveelement (see the “7” in FIG. 9), and then cost is saved, moreover, therestriction of designing said substrate 10 is also decreased, and thereliability of said substrate 10 is enhanced.

FIG. 1B shows a substrate 10 comprising: an insulator 30 having a firstupper surface 31, a first lower surface 32 and a side wall 37, whereinthe first lower surface 32 of insulator 30 is not substantially flat(i.e. rough); a receiving area 14 is used for accommodating a chip(s),in order that a chip enables to be mounted on said substrate 10; aplurality of first conductive elements 70, each conductive element 70having a first upper surface 71, a first lower surface 72, a first sideedge 73 and an extending portion 75, wherein the extending portion 75 iscoupled with the first upper surface 31 of insulator 30, and saidextending portion 75 is common unitary with said first conductiveelement 70 (i.e. both said extending portion 75 and said firstconductive element 70 are substantially unitary), meanwhile, the firstside edge 73 of first conductive element 70 encapsulated by theinsulator 30 and embedded therein, wherein, the first upper, lowersurfaces 71,72 of first conductive element 70 protrude and expose thefirst upper, lower surfaces 31, 32 of insulator 30 for externalconnection respectively; Accordingly, due to the first conductiveelement 70 having an extending portion 75, then (i.) the surface of saidfirst conductive element 70 contacted with the insulator 30 is increased(due to not only the first side edge 73 is encapsulated by the insulator30 but the extending portion 75 is also coupled with said insulator 30),in this manner, said first conductive element 70 enables to be coupledwith said insulator 30 more securely, and then the reliability of saidsubstrate 10 can be enhanced; and (ii.) said extending portion 75enables to be extending upon the first upper surface 31 of saidinsulator 30, then the restriction of designing said substrate 10 isdecreased, it is good for the industry; In addition, the other moreadvantages of said extending portion 75 will be explained in FIG. 3.

FIG. 1C shows a substrate 10 comprising: an insulator 30 having a firstupper surface 31, a first lower surface 32 and a through hole 15 whichis serving as a receiving area of said substrate 10 for accommodatingchip(s) therein; a plurality of first conductive elements 70, each firstconductive element including a protruding portion 77 having an uppersurface which is employed as the first upper surface 71 of said firstconductive element 70, a first lower surface 72 and a first side edge73; a plurality of second conductive elements 70 a including a firstupper surface 71 a of said second conductive element 70 a, a first lowersurface 72 a and a first side edge 73 a, wherein each first, secondconductive element 70,70 a encapsulated by the insulator 30 and embeddedtherein, and each first upper, lower surface 71/71 a,72/72 a of saidfirst, second conductive elements 70, 70 a exposed to the first upper,lower surface 31, 32 of insulator 30 respectively, wherein the firstupper surface 71 of first conductive element 70 is not protruded butexposed to the first upper surface 31 of insulator 30, meanwhile thefirst upper surface 71 a of second conductive element 70 a is below andexposed to the first upper surface 31 of insulator 30, wherein becausesaid first conductive element 70 consists of the protruding portion 77,then (i.) the surface of said substrate 10 contacted with theencapsulant (see “40” in FIG. 2) is increased, then said substrate 10enables to be encapsulated by the encapsulant more securely, in thismanner, the reliability of electrical device can be enhanced (refer tothe detailed description in FIG. 2); and (ii.) the surface of said firstconductive element 70 contacted with a conductive bump of chip (see “65”in FIG. 5) is increased, then said first conductive element 70 enablesto be electrically connected to the conductive bump (65) firmly (referto the detailed description in FIG. 5).

FIG. 1D shows a substrate 12 which is formed by two substrates 10 inaccordance with the present invention, and each structure of substrate10 is substantially the same as each other, said substrates 10 arestacked, wherein said substrates 10 are electrically connected to eachother through the solder paste 62, and wherein each submember 80 such asa heat spreader is connected to each other through said solder pastetoo, in this manner, the heat dissipation of the substrate 12 enables tobe enhanced, and wherein each first conductive element 70 having aprotruding portion 77 c (the advantages of said protruding portion 77 cbeing described in the detailed description of FIG. 1E), and eachprotruding portion 77 c having a lower surface which is employed as thefirst lower surface 72 of said first conductive element 70.

FIG. 1E shows a substrate 10 comprising: a plurality of first conductiveelement 70, 70 a having a first upper surface 71, 71 a, a first lowersurface 72, 72 a, a first side edge 73, 73 a and a protruding portion 77c, 77 ca respectively, In addition, said first conductive element 70 afurther comprising an extending portion 75 a which is extended from theprotruding portion 77 ca of first conductive element 70 a; an insulator30 having a first upper surface 31, a first lower surface 32 and a sidewall 37; each first conductive element 70, 70 a encapsulated by saidinsulator 30 and embedded therein respectively, wherein each first sideedge 73, 73 a of said first conductive element 70, 70 a beingencapsulated by said insulator 30, and wherein each protruding portion77 c, 77 ca of first conductive element 70, 70 a being protruded andexposed to the first lower surface 32 of insulator 30, in this manner,each the first lower surface 72, 72 a of first conductive element 70,70a being protruded and exposed to the first lower surface 32 of insulator30 too; each first upper surface 71, 71 a of said first conductiveelement 70, 70 a exposed to said first upper surface 31 of saidinsulator 30 for being plated by (a) conductive material(s) such asnickel, palladium, silver, gold or the like for enhancing the quality ofelectrical connection, wherein each first upper surface 71, 71 a of eachfirst conductive element 70, 70 a being below said first upper surface31 of said insulator 30, therefore, a recess 301, 301 a being formed byeach first conductive element 70, 70 a associated with said insulator 30respectively, wherein the bottom of each recess 301, 301 a formed byeach first upper surface 71, 71 a of first conductive element 70, 70 a,and wherein each recess 301, 301 a being for accommodating at least aconductive material; and a plurality of conductive materials 55, 55 a,wherein each first upper surface 71, 71 a of each conductive element 70,70 a being plated by each corresponding conductive material 55, 55 a,and wherein said conductive material (55,55 a) being placed within saidrecess (301,301 a), and wherein each upper surface 551, 551 a of eachconductive material 55, 55 a exposed to said first upper surface 31 ofsaid insulator 30 respectively, In addition, the extending portion 75 aof first conductive element 70 a is common unitary with said protrudingportion 77 ca of first conductive element 70 a and is coupled with thefirst lower surface 32 of insulator 30; Accordingly, (i.) due to theprotruding portion (77 c,77 ca) of first conductive element (70, 70 a)being protruded and exposed to the first lower surface 32 of insulator30, it is convenient for the first conductive element (70,70 a) toelectrically connect to outside, then the solder ball is not needed, thecost for manufacturing the substrate 10 decreased; and (ii.) due to thefirst conductive element 70 a having an extending portion 75 a, then(a.) the surface of said first conductive element 70 a contacted withthe insulator 30 is increased (due to not only the first side edge 73 ais encapsulated by the insulator 30 but the extending portion 75 a isalso coupled with said insulator 30), in this manner, said firstconductive element 70 a enables to be coupled with said insulator 30more securely, and then the reliability of said substrate 10 can beenhanced; and (b.) said extending portion 75 a enables to be attachedand extended upon the first lower surface 32 of said insulator 30, thenthe restriction of designing said substrate 10 is decreased, it is goodfor the industry.

The mentioned-above insulator of substrate may be made of glass,ceramics, silicon, adhesive means such as glue, epoxy or the like,meanwhile, by means of plating process, the portion of conductiveelement which is exposed to the insulator and the portion of submemberwhich is also exposed to the insulator can be plated by at least aconductive material such as nickel, palladium, silver, gold or the likefor enhancing the quality of electrical connection, moreover, both theconductive element and the submember enable to be formed bypredetermined shapes (patterns), furthermore, the side edge ofconductive element and the side edge of submember 80 may also be exposedto the side wall 37 of insulator 30 as required.

FIG. 2-8 show embodiments of electrical device, wherein the substrate ofelectrical device is in accordance with the present invention, detaileddescription as follow:

FIG. 2 shows an electrical device 90 comprising: a substrate 10 includesan insulator 30, a plurality of first conductive elements 70, and asubmember 80 serving as a heat spreader, wherein said first conductiveelement 70 and submember 80 are embedded in the insulator 30, said firstconductive element 70 having a protruding portion 77 which including anupper surface which is employed as the first upper surface of said firstconductive element 70 and a first lower surface 72 which is protrudingthe first lower surface 32 of insulator 30 for external connection; saidsubmember 80 having a cavity 86, wherein the cavity 86 is serving as thereceiving area of substrate 10 for situating chip etc., and the firstupper, lower surface 81, 82 of submember 80 exposed to the insulator 30respectively; a chip 20 placed in the cavity 86 of submember 80; aplurality of conductive means (conductive wires) 60 electricallyconnected the chip 20 to the first conductive element 70 and thesubmember 80 respectively; an encapsulant 40 encapsulates the chip 20,conductive means 60 and the substrate 10; accordingly, due to a portion(first lower surface 72) of the first conductive element 70 protrudesand exposes the insulator 30 for electrical connection, in this manner,it is easy for the first conductive element 70 to be electricallyconnected to outside, then the solder ball is not needed, the cost formanufacturing the electrical device 90 is decreased, Besides, theconductive wire 60 enables to be electrically connected to the firstconductive elements 70 directly, then it is not necessary for thesubstrate 10 to be comprised of a conductive element (see the “7” inFIG. 9), and then the restriction for designing the substrate 10 isdecreased; furthermore due to the first conductive element 70 having aprotruding portion 77, then the surface of said first conductive element70 contacted with the encapsulant 40 is increased, in this manner, thesubstrate 10 enables to be encapsulated by the encapsulant 40 moresecurely in order to prevent from peeling-off problem, and then thereliability of electrical device 90 enhanced, meanwhile, due to thesubmember 80 of substrate 10 serving as a heat spreader, the heatdissipation of electrical device 90 enhanced too, in addition, thesubmember 80 of substrate 10 also serving as a conductive element, andthen said submember 80 of substrate 10 enables to electrically connectto outside too, wherein another advantage of the protruding portion 77of said first conductive element 70 will be explained in FIG. 5.

FIG. 3 shows an electrical device 90, wherein both the first conductiveelements 70 and the second conductive elements 70 a are embedded in theinsulator 30, the first upper surface 71 of said first conductiveelement 70 protrudes and exposes the first upper surface 31 of insulator30, and the extending portion 75 of said first conductive element 70situated on the first upper surface 31 of insulator 30, nevertheless,the first upper surface 71 a of the second conductive element 70 a isnot protruded but exposed to the first upper surface 31 of insulator 30,in this manner, the first upper surface 71 and the first upper surface71 a are not in the same horizontal level; a chip 20 mounted on thereceiving area 14 of said substrate 10; accordingly, due to the firstupper surface 71 of first conductive element 70 and the first uppersurface 71 a of the second conductive element 70 a are not in the samehorizontal level, in this manner, the gap “G” between the conductivemean (wire) 60 which is electrically connected to the first conductiveelement 70 and another conductive mean (wire) 60 which is electricallyconnected to the second conductive element 70 a enables to become wider,in order to prevent said conductive means (wires) 60 from causingshort-circuit problem; meanwhile due to the extending portion 75 offirst conductive element 70, the first conductive element 70 enables tobe getting closer to the receiving area 14 of substrate 10, in thismanner, the distance “D” between the chip 20 and the first conductiveelement 70 enables to be shortened, and then the conductive wire 60which is electrically connected the chip 20 to the first conductiveelement 70 enables to be shortened, therefore, the material ofconductive wire 60 saved, and the cost of manufacturing the electricaldevice 90 saved; in addition, the second side edge 74 of the firstconductive element 70 exposed to the side wall (37; not shown) of theinsulator 30.

FIG. 4 shows an electrical device 90, wherein the substrate 10 includinga submembers 80 such as a heat spreaders, a second conductive element 70a having a through hole 79 a which is serving as the receiving area (15)of substrate 10; the chip 20 placed in the through hole 79 a of saidsecond conductive element 70 a, and said second conductive element 70 asurrounding said chip 20, wherein said second conductive element 70 maybe serving as a power supply bus (e.g. positive supply bus and/ornegative supply bus) in order to be electrically connected to aplurality of conductive wires 60; accordingly, due to the through hole79 a of said second conductive element 70 a, the chip 20 enables to beplaced therein, then the electrical device 90 thickness is thinner,moreover, due to the submembers 80 embedded in the insulator 30, in thismanner, the heat dissipation of the chip 20 will be enhanced.

FIG. 5 shows an electrical device 90, wherein the first conductiveelement 70 having a plurality of protruding portions 77, 77 c which areopposite to each other, wherein said protruding portion 77 of the firstconductive element 70 being protruded and exposed to said first uppersurface 31 of the insulator 30, however said (another) protrudingportion 77 c of the first conductive element 70 being not protruded butexposed to the first lower surface 32 of said insulator 30; a chip 20situated on the receiving area 14 of substrate 10, wherein the activesurface 21 of said chip 20 having a plurality of conductive means(bumps) 65, said conductive means (bumps) 65 electrically connected thechip 20 to the first conductive elements 70 of the substrate 10respectively; an encapsulant 40 encapsulates the chip 20, conductivemeans 65 and the substrate 10; accordingly, due to the protrudingportion 77 of said first conductive element 70, the first conductiveelement 70 surface contacted with the conductive bump 65 is increased,in this manner, the first conductive element 70 enables to be coupledwith the conductive bump 65 more securely, in order to prevent the chip20 from peeling off the substrate 10, and then the reliability ofelectrical device 90 enables to be enhanced; furthermore the inactivesurface 22 of the chip 20 may also be encapsulated by the encapsulant 40as required; in addition, the material of insulator 30 may be the sameas the material of encapsulant 40 as required, and the chip 20 isemployed as a flip chip.

FIG. 6 shows an electrical device 90, wherein, the extending portion 75of first conductive element 70 disposed on the first upper surface 31 ofinsulator 30; a chip 20 mounted on the receiving area 14, meanwhile saidchip 20 also coupled with the first upper surface 71 of the firstconductive element 70, wherein the receiving area 14 also including aportion of first conductive element 70; accordingly, due to a portion offirst conductive element 70 involved in the receiving area 14, in thismanner, the size of said electrical device 90 enables to be shrunk, andit is good for the industry; in addition, a solder mask 46 attached ontothe substrate 10 for protecting said substrate 10.

FIG. 7 shows an electrical device 90, wherein the extending portion 75of first conductive element 70 coupled with the first lower surface 32of insulator 30, the submember 80 having a through hole 88 serving as anopening of said substrate 10, in this manner, the substrate 10 having anopening (88); a chip 20, wherein the active surface 21 of said chip 20is coupled with the first upper surface 31 of insulator 30,(i.e. theactive surface 21 of said chip 20 is coupled with the surface ofsubstrate 10), meanwhile a portion of active surface 21 of chip 20exposed to the opening of the substrate 10; a plurality of conductivewires 60 pass through the opening of substrate 10 and electricallyconnect the chip 20 to either the first conductive elements 70 or thefirst lower surface 82 of submember 80 respectively; a plurality ofencapsulant 40 encapsulate the chip 20, conductive wires 60 and thesubstrate 10; accordingly, due to both the first upper surface 71 andthe first lower surface 72 of first conductive element 70 exposed to theinsulator 30 respectively, in this manner, Not only the electricaldevice 90 enables to be electrically connected to outside by means ofthe solder ball 50 attached onto both the first upper surface 71 and thefirst lower surface 72 of first conductive element 70, but theelectrical device 90 also enables to be electrically connected toanother electrical device (not shown) and stacked thereon, in thismanner, said electrical device 90 will become more useful.

FIG. 8 shows an electrical device 90, wherein the insulator 30 having aprotruding portion(s) “P” which is (are) protruding the first uppersurface 31 of insulator 30, wherein said protruding portion “P” is closeto the periphery of the insulator30; a chip 20 mounted on the receivingarea 14; a plurality of conductive wires 60 electrically connect thechip 20 to the first conductive elements 70 respectively; a lid “C”situated on the protruding portion “P” of insulator 30, in this manner,a sealed area 17 is formed by both the lid “C” and the substrate 10,then the chip 20 and the conductive wires 60 are all hermetically sealedin the sealed area 17, wherein the chip 20 may be employed as an imagesensor, optical chip or the like, and the lid “C” may be employed as atransparent plate as required; in addition, an encapsulant (not shown)may be filled into the sealed area 17 for encapsulating the chip 20,conductive wires 60 and the substrate 10, nevertheless the lid “C” maybe employed as a heat spreader as required.

In accordance with the foregoing descriptions accompanying drawings,this invention has been described in terms of several preferredembodiments, various alternations and modifications can be made tobecome apparent to those skilled in the art; For examples: as shown inFIG. 1A, wherein said submember 80 may further include a through hole(refer to “88” in FIG. 7) as required;; as shown in FIG. 5, wherein aheat spreader (not shown) may be mounted on the inactive surface 22 ofsaid chip 20; furthermore, the first conductive element of substrate inaccordance with the present invention enable to be predetermined shapeas required; Accordingly, since many such various alterations and/ormodifications can be made to the foregoing descriptions, it is to beunderstood that the scope of the invention is not limited to thedisclosed embodiments but is defined by the appended claims.

1. A substrate for electrical device, comprising: at least a firstconductive element having at least a first upper surface, a first lowersurface, a first side edge and a protruding portion; at least aninsulator having at least a first upper surface, a first lower surfaceand a side wall, said first conductive element encapsulated by saidinsulator and embedded therein, in this manner, said first side edge ofsaid first conductive element being encapsulated by said insulator,wherein said protruding portion of said first conductive element beingprotruded and exposed to the first lower surface of said insulator, inthis manner, said first lower surface of said first conductive elementbeing protruded and exposed to the first lower surface of said insulatortoo; and wherein said first upper surface of said first conductiveelement exposed to said first upper surface of said insulator for beingplated by at least a conductive material, wherein said first uppersurface of said first conductive element being below said first uppersurface of said insulator, therefore, at least a recess formed by saidfirst conductive element associated with said insulator, wherein thebottom of said recess formed by said first upper surface of said firstconductive element, and wherein said recess being for accommodating atleast a conductive material; and at least a conductive material, whereinsaid first upper surface of said conductive element being plated by saidconductive material, and wherein at least a portion of said conductivematerial being placed within said recess, and wherein at least ananother portion of said conductive material exposed to said first uppersurface of said insulator.
 2. The substrate of claim 1, furthercomprising at least an another conductive material, wherein saidconductive material being plated by said another conductive material,and wherein at least a portion of said another conductive materialexposed to said first upper surface of said insulator.
 3. The substrateof claim 2, further comprising at least a further another conductivematerial; wherein said another conductive material being plated by saidfurther another conductive material, and wherein at least a portion ofsaid further another conductive material exposed to said first uppersurface of said insulator.
 4. The substrate of claim 1, wherein saidinsulator further comprising at least a through hole.
 5. The substrateof claim 1, wherein said first conductive element further comprising atleast an extending portion which is extended from said protrudingportion of first conductive element, and wherein said extending portionis common unitary with said protruding portion of first conductiveelement and is coupled with said first lower surface of insulator.